Production Technologies
We maintain state-of-the-art facilities and equipment to supply the following technologies:
- SMT assembly
- THT assembly
- N2 convection reflow
- Vapour phase reflow
- N2 selective soldering
- Conformal coating for printed circuits
- Macromelt® Moulding
Our highly modern and fully automatic SMD assembly lines are equipped with an array of Siemens pick-and-place machines. These machines reflect state-of-the-art technology and guarantee fast, precise production of your SMD assemblies.
Manufacturing capacity, SMT assembly:
| Maximum output | 1,500 million assemblies p.a. |
| Minimum assembly dimensions | Type 0201 |
| Maximum assembly dimensions | 55 mm² |
| Fine pitch placement | To 0.3 mm |
| Circuit board dimensions | Max. 610 mm x 460 mm |
| Reflow | Vapour phase reflow, convection reflow |
All fully automated reflow processes are performed in a controlled nitrogen atmosphere (protective gas) and are available as leaded and unleaded processes.
Manufacturing capacity, THT assembly:
| Maximum assembly output | 80 million assemblies p.a. |
| Automated assembly preparation | |
| Semi-automatic assembly with laser assembly benches | |
| Double wave soldering | |
| Selective soldering | |
| Board dimensions | max. 650 mm x 450/500 mm |
All fully automated reflow processes are performed in a controlled nitrogen atmosphere (protective gas) and are available as leaded and unleaded processes.